{
  "$schema": "https://cwwindex.today/data/industry_pulse_72h.schema.json",
  "schemaVersion": 1,
  "generatedAt": "2026-07-17T10:00:00+08:00",
  "windowHours": 72,
  "windowStart": "2026-07-14T10:00:00+08:00",
  "windowEnd": "2026-07-17T10:00:00+08:00",
  "coverage": {
    "monitoredThemes": [
      "HBM",
      "DRAM",
      "NAND",
      "CXL_AND_MEMORY_INTERFACES"
    ],
    "qualifyingEventCount": 2,
    "primarySourceCount": 2,
    "noteZh": "仅收录落在窗口内、可回到公司原始披露或监管原文且与存储产业链直接相关的高信号事件。",
    "noteEn": "Only high-signal events inside the window, directly relevant to the memory value chain and traceable to company or regulatory primary sources, are included."
  },
  "events": [
    {
      "id": "20260716-micron-auto-sca",
      "publishedDate": "2026-07-16",
      "sourceType": "COMPANY_PRIMARY",
      "sourceTitle": "Micron Technology Investor Relations",
      "sourceUrl": "https://investors.micron.com/news-releases/news-release-details/micron-strengthens-automotive-ecosystem-supply-through-strategic",
      "titleZh": "美光与七家车用技术伙伴建立长期存储供应协作",
      "titleEn": "Micron formalizes long-term memory supply collaboration with seven automotive technology partners",
      "summaryZh": "美光披露与高通、伟世通、HARMAN、电装、现代 Mobis 等伙伴签署战略客户协议，为智能座舱、ADAS 与软件定义汽车提供长期内存与存储供应能见度。",
      "summaryEn": "Micron disclosed strategic customer agreements with partners including Qualcomm, Visteon, HARMAN, DENSO and Hyundai Mobis to improve long-term memory and storage supply visibility for digital cockpits, ADAS and software-defined vehicles.",
      "impactZh": "这是需求能见度与供应协同信号，不等同于已确认订单金额、价格增长率或官方指数变动依据。",
      "impactEn": "This is a demand-visibility and supply-coordination signal, not a disclosed order value, price-growth rate or input to official index changes.",
      "tags": [
        "DRAM",
        "NAND",
        "STORAGE",
        "AUTOMOTIVE"
      ],
      "companies": [
        "Micron",
        "Qualcomm",
        "Visteon",
        "HARMAN",
        "JOYNEXT",
        "DENSO",
        "Astemo",
        "Hyundai Mobis"
      ],
      "evidenceStatus": "VERIFIED",
      "confidence": "HIGH"
    },
    {
      "id": "20260715-usitc-dram-hbm-1511",
      "publishedDate": "2026-07-15",
      "sourceType": "REGULATOR_PRIMARY",
      "sourceTitle": "U.S. International Trade Commission",
      "sourceUrl": "https://www.usitc.gov/secretary/fed_reg_notices/337/337_1511notice07152026sgl.pdf",
      "titleZh": "美国国际贸易委员会启动 DDR5 DIMM 与 HBM 相关调查",
      "titleEn": "USITC institutes an investigation covering DDR5 DIMMs and HBM",
      "summaryZh": "USITC 的 337-TA-1511 调查范围明确涵盖 DDR5 代 DIMM、HBM，以及包含这些器件的服务器、计算与存储系统；被申请调查的相关方包括三星电子、Google、Supermicro、NVIDIA 与 Broadcom。",
      "summaryEn": "USITC investigation 337-TA-1511 expressly covers DDR5-generation DIMMs, HBM, and servers, computing systems and storage systems containing them; named respondents include Samsung Electronics, Google, Supermicro, NVIDIA and Broadcom.",
      "impactZh": "调查启动不代表侵权结论；该事件被标记为潜在供应链与合规风险，而不是既成禁令。",
      "impactEn": "Institution does not determine infringement; the event is classified as a potential supply-chain and compliance risk, not an existing exclusion order.",
      "tags": [
        "HBM",
        "DRAM",
        "MEMORY_INTERFACE",
        "REGULATION"
      ],
      "companies": [
        "Samsung Electronics",
        "Google",
        "Supermicro",
        "NVIDIA",
        "Broadcom",
        "Netlist"
      ],
      "evidenceStatus": "VERIFIED",
      "confidence": "HIGH"
    }
  ],
  "policy": {
    "primarySourcesRequired": true,
    "licensedPriceDataRepublished": false,
    "rumorsAllowed": false,
    "marketImpactInferred": false,
    "emptyWindowBehavior": "PUBLISH_VERIFIED_EMPTY_STATE"
  }
}